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Oct 27, 2021

Synopsys and TSMC Drive Chip Innovation with Development of Broadest IP Portfolio on TSMC N4P Process

DesignWare Interface and Foundation IP Deliver Optimized Power and Performance for High-Performance Computing and Mobile SoCs

Highlights from this announcement: DesignWare Interface IP for the most widely used protocols delivers the required high bandwidth and low latency for efficient data connectivity in...
Oct 20, 2021

Synopsys Digital and Custom Design Platforms Achieve Certification for TSMC N3 Process

The Platforms Optimize PPA for Next-Generation HPC, Mobile, 5G and AI Designs

Highlights: Synopsys platforms deliver enhanced features to support new requirements for TSMC N3 and N4 processes The Synopsys Fusion Design Platform facilitates faster timing closure and...
Oct 20, 2021

Synopsys Expands Strategic Technology Collaboration with TSMC to Extend 3D-System Integration Solutions for Next-Generation High-Performance Computing Designs

Synopsys' 3DIC Compiler Delivers Seamless Access to TSMC 3DFabric Technologies

Highlights of this Announcement: Expanded strategic collaboration delivers comprehensive 3D-system integration capabilities, enabling the aggregation of hundreds of billions of transistors in a...
Oct 12, 2021

Synopsys and Dassault Systèmes Partner to Enable Industry's First Holistic Lighting Design Platform

Synopsys Optical Design Solutions Integrated with Dassault Systèmes' 3DEXPERIENCE Platform Facilitates Creation of Smarter, Safer and Distinctive Optical Systems

Synopsys, Inc. (Nasdaq: SNPS) and Dassault Systèmes (Euronext Paris: FR0014003TT8, DSY.PA) today announced their partnership to integrate Synopsys optical design solutions into the Dassault Systèmes
Oct 7, 2021

Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions

HBM3 IP Solution Delivers Maximum Memory Bandwidth of 921 GB/s for High-Performance Computing, AI, and Graphics SoCs

Highlights of this Announcement: The DesignWare HBM3 Controller, PHY, and Verification IP reduces integration risk and maximizes memory performance in 2.5D multi-die systems Low-latency HBM3...

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