Press Releases

Press Releases are listed below in chronological order with the most recent one appearing first. Please use the tool below to search for press releases in a particular year, category or that contain a keyword. For additional search options, please use the Advanced Search tool.

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• Dec 4, 2019

  Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2019

  Q4 2019 Financial Highlights
• Nov 18, 2019

  Synopsys Custom Compiler Adopted by Samsung Foundry to Accelerate IP Design for 5LPE Process Technology with EUV Technology

  Samsung Releases 5LPE AMS Reference Flow Based on Synopsys Custom Design Platform
• Nov 15, 2019

  Synopsys Completes Acquisition of DINI Group
• Nov 13, 2019

  Synopsys Announces Earnings Release Date for Fourth Quarter and Fiscal Year 2019
• Nov 12, 2019

  Synopsys DesignWare ARC Data Fusion IP Subsystem Incorporated by Himax in Their Artificial Intelligence WiseEye ASIC

  Always-On Sensing ASIC Enables Machine Learning for Ultra-Low Power Applications
• Nov 11, 2019

  Samsung Foundry Deploys Industry-Leading Synopsys TestMAX XLBIST Dynamic In-System Test Solution for Automotive Safety

  Part of a Broader Collaboration for Functional Safety and Manufacturing Test to Achieve ASIL-D Level Design Safety
• Nov 11, 2019

  Synopsys to Acquire Certain IP Assets from eSilicon

  Acquisition Will Expand DesignWare IP Portfolio and Add a Team of Experienced R&D Engineers to Serve Growing AI and Cloud Markets
• Nov 7, 2019

  Synopsys VC LP for Low Power Signoff Verification Delivers Up to 5X Runtime Gain at Samsung

  Signoff Abstract Model Flow for Hierarchical Verification Delivers Higher Performance and Capacity with No Loss in Quality of Results or Debug Visibility
• Oct 30, 2019

  Synopsys and AMD Execute Multi-Year ZeBu Emulation Agreement

  New Agreement Includes Optimization of ZeBu and VCS Software for AMD EPYC Processor-based Servers
• Oct 29, 2019

  Synopsys Accelerates Cloud Computing SoC Designs with New Die-to-Die PHY IP in Advanced 7nm FinFET Process

  DesignWare Die-to-Die PHY Enables Ultra- and Extra-Short Reach Connectivity in Large, Multi-Chip Module Designs

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