Press Releases

Press Releases are listed below in chronological order with the most recent one appearing first. Please use the tool below to search for press releases in a particular year, category or that contain a keyword. For additional search options, please use the Advanced Search tool.

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• Oct 22, 2020

  Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications

  Comprehensive Design and Analysis Capabilities Extend Moore's Law for SoCs Through Samsung's Multi-die Integration
• Oct 21, 2020

  Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade

  Collaboration with IBM Research's AI Hardware Center Addresses the Challenges of Developing New AI Chip Architectures with Innovative Design Methodologies
• Oct 20, 2020

  TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
• Oct 20, 2020

  Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence

  New Elastic CPU, Explorer LVS, and Machine Learning Features Deliver Accelerated Time-to-Results for Automotive, High-Performance Computing, AI, Networking and Wireless Applications
• Oct 19, 2020

  Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution

  SaberEXP Delivers Fastest Convergence for Early Power Component Design and Seamless Export to High-Fidelity System Validation

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