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Highlights First collaboration milestone speeds validation of IP and design correlation on UMC's 14-nm FinFET process...
Highlights: Industry's first M-PCIe® IP interoperability demonstration, developed in conjunction with Intel, unveiled at PCI-SIG® Developers...
Collaboration will provide the framework for heterogeneous 2.5D/3D-IC systems Will optimize silicon interposer technology for...
Highlights: OCZ achieved first-pass silicon success for its NAND flash Vector SSD with Synopsys' DesignWare DDR2/3-Lite PHY, Embedded Memories...
Highlights: New Synopsys Formality® Ultra solution cuts days of effort for each functional engineering change order (ECO) Includes advanced...