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Oct 8, 2020

Synopsys' Digital Design Technology Symposium to Showcase Latest Innovations for AI, Automotive, HPC and 5G Chip Design

Virtual Event to Highlight Unique Solutions, Methodologies and Techniques Used to Overcome Complex Design Challenges

Synopsys, Inc. (Nasdaq: SNPS) is hosting its first Digital Design Technology Symposium, featuring Synopsys' Fusion Design Platform solutions to help digital designers and engineering management,...
Sep 30, 2020

Synopsys Delivers Industry's First Processor IP Certified for Full ISO 26262 ASIL D Compliance

DesignWare ARC EM22FS Functional Safety Processor IP Meets ASIL D Random Plus ASIL D Systematic Compliance to Accelerate Automotive SoC-Level Certification

Highlights: DesignWare ARC EM22FS Processor meets stringent random hardware fault detection and systematic functional safety development flow requirements to achieve ISO 26262 ASIL D compliance...
Sep 28, 2020

Synopsys to Host Panel on AI for Chip Design at AI Hardware Summit 2020

Moderated by Industry Analyst Karl Freund of Moor Insights

Synopsys, Inc. (Nasdaq: SNPS) today announced that Arun Venkatachar, VP of AI and Central Engineering, will participate in a panel discussion with participants from Intel and Google at the 2020 AI...
Sep 24, 2020

Synopsys and GLOBALFOUNDRIES Collaborate to Expand Fusion Compiler Benefits for Latest Platforms

Synopsys' Unique Product Delivers Best-in-Class PPA to Accelerate Innovation on GF Platform Offerings for Aerospace and Defense, Automotive and Cloud/AI Applications

Highlights: Close collaboration on technology enablement unlocks optimal PPA potential of GLOBALFOUNDRIES® 12LP and 12LP+ (12nm FinFET) platforms and 22FDX® (22nm FD-SOI) platforms Targeted...
Sep 24, 2020

Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP+ FinFET Solution

DesignWare IP Delivers Significant Performance and Power Advantages for Cloud Computing and Edge AI SoCs on GF 12LP+ Solution

Highlights: DesignWare IP portfolio for GF 12LP+ solution includes USB4, PCIe 5.0, Die-to-Die HBI and 112G USR/XSR, 112G Ethernet, DDR5, LPDDR5, MIPI, OTP NVM and more Long-standing collaboration...

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