Cloud native EDA tools & pre-optimized hardware platforms
All News Releases
Su | Mo | Tu | We | Th | Fr | Sa |
---|---|---|---|---|---|---|
Su | Mo | Tu | We | Th | Fr | Sa |
---|---|---|---|---|---|---|
Synopsys, Inc. (Nasdaq: SNPS) today announced it will report results for the fourth quarter and fiscal year 2020 on Wednesday, Dec. 2, 2020, after the market close. A conference call to review the...
Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of the industry's first Verification IP (VIP) for Compute Express Link™ (CXL™) 2.0 designed for breakthrough performance in...
Synopsys, Inc. (Nasdaq: SNPS) today announced it received two 2020 World Electronics Achievement Awards (WEAA): "Innovative Product of the Year" for DSO.ai™ (Design Space Optimization AI) and...
Highlights: Synopsys and Samsung have collaborated on the enablement of Fusion Design Platform to unleash the benefits of Samsung's most advanced process nodes Certified flow provides designers a...
Highlights: Samsung and Synopsys collaboration will accelerate deployment of 3nm gate-all-around (GAA) process technology by designers of advanced applications AMS Design Reference Flow provides...
Highlights Jointly developed VDK supports Infineon's next generation AURIX TC4xx 32-bit Microcontroller with Parallel Processing Unit for affordable and powerful implementation of Artificial...
Highlights: Broad library of iPDKs enables Synopsys Custom Design Platform for a wide range of advanced and legacy process technologies Complete iPDKs enablement unlocks advanced features that...
Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5-nanometer SoC featuring eight high-bandwidth...
Highlights: Unique IBM collaboration leverages Synopsys as lead EDA and IP partner for IBM's AI Hardware Center; silicon verification and demonstrable performance improvements already achieved...
Highlights: Synopsys selected as TSMC OIP Partner of the Year for interface IP and tool enablement for the 10th consecutive year Collaborations on interface IP, joint development of 3nm design...