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Jun 24, 2013

Synopsys Collaborates with A*STAR IME to Optimize TSI Technology

Synopsys Brings its Expertise in 3D-IC Solutions to Singapore's A*STAR IME-Led 2.5D Through-Silicon Interposer Consortium

Collaboration will provide the framework for heterogeneous 2.5D/3D-IC systems Will optimize silicon interposer technology for...
Jun 19, 2013

OCZ Technology Group Achieves First-Pass Silicon Success with DesignWare IP and Synopsys Professional Services

Silicon-Proven DesignWare IP and Consulting Services Reduce Integration Risk and Help Accelerate Deployment of Complete SoC Design Flow

Highlights: OCZ achieved first-pass silicon success for its NAND flash Vector SSD with Synopsys' DesignWare DDR2/3-Lite PHY, Embedded Memories...
Jun 17, 2013

Synopsys Delivers 2X Speedup for Implementing and Verifying Functional ECOs

New Formality Ultra Extends Equivalency Checking to Accelerate Design Closure

Highlights: New Synopsys Formality® Ultra solution cuts days of effort for each functional engineering change order (ECO) Includes advanced...
Jun 12, 2013

Synopsys Announces Design Kit Optimized for All SoC Processor Cores

DesignWare HPC Design Kit Yields Superior Performance, Power and Area for CPU, GPU and DSP Cores

Highlights: One design kit for optimizing all processor cores on an SoC that includes an ultra-high density memory compiler and more than 125...
Jun 11, 2013

Synopsys Unveils New Synthesis-Based Test Technology Delivering Up to 3X Higher Compression

Innovative Technology Includes Advances for Pin-Limited Test

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic...

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