Cloud native EDA tools & pre-optimized hardware platforms
MOUNTAIN VIEW, Calif., Oct. 21, 2020 /PRNewswire/ --
Synopsys, Inc. (Nasdaq: SNPS) today announced the latest stages in its ongoing collaboration with IBM Research's AI Hardware Center to advance the development of chip architectures and design methodologies critical to the next generation of AI chips. Synopsys is working closely with IBM to implement the latest AI Hardware Center technologies in full chip solutions, which could be commercialized in the near future. Their unique collaboration was established last year, leveraging the rich expertise of IBM's renowned research organization, and combining the efforts of multiple commercial partners, as well as academic and government entities that support the initiative.
The overarching goal of the work with IBM is to achieve a continued trend of annual doubling of the AI compute performance for a decade or more. To do this, the companies are working together to redesign hardware with AI specifically in mind, with a vision of expanding the use of AI to solve more problems in business and the world in general. This work includes developing new computing accelerators, technologies, and architectures designed and optimized specifically for AI computation.
"Together, AI and hybrid cloud will play a critical role in the next generation of enterprise computing and scaling AI, with new hardware solutions as part of a wider effort at IBM Research to envision and realize What's Next in AI," said Mukesh Khare, Vice President, Hybrid Cloud, IBM Research. "To achieve this, we need to build a new class of AI hardware accelerators that increase compute power without the demand for more energy. Additionally, developing new AI chip architectures will enable companies to dynamically run large AI workloads in the hybrid cloud. Synopsys' unmatched breadth of experience and technical offering is an extremely valuable asset in this effort."
The AI Hardware Center has achieved several tapeouts and test chips of designs targeting advanced process manufacturing nodes, supporting its aggressive roadmap. Part of the roadmap to reach 1,000x performance improvement by 2029 was the delivery of AI processor cores that improve performance by 2.5x each year; IBM Research realized a gain of twice that in its first year.
Synopsys' participation, which includes both technology and engineering personnel collaborating with the IBM researchers, focuses on addressing several of the key challenges in complex AI chip design, verification and manufacturing. Specifically, Synopsys brings expertise in three main areas:
"This a unique opportunity for Synopsys to be part of a collaborative effort that connects the entire semiconductor value chain," said Arun Venkatachar, Vice President, Artificial Intelligence and Central Engineering at Synopsys. "To realize IBM Research's vision, the AI hardware being designed requires a fundamentally new approach, which needs innovative strategies – from tools, to IP, to workflows and manufacturing. Our involvement with the AI Hardware Center provides a platform for us to help drive the future of AI chip design with a synergistic partner."
Read more about Synopsys' collaboration with the IBM Hardware Research Center:
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world's 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you're a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.
SOURCE Synopsys, Inc.