Synopsys Honors Freescale Semiconductor with 2013 Tenzing Norgay Interoperability Achievement Award
Recognizing leadership and contribution to standards-based collaboration across industry

MOUNTAIN VIEW, Calif., Oct. 23, 2013 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, announced that Freescale® Semiconductor will receive Synopsys' thirteenth annual Tenzing Norgay Interoperability Achievement Award for advancing industry standards that enable interoperable system design flows. The award will be presented at the IEEE - SA Symposium on EDA Interoperability (http://standards.ieee.org/events/edasymposium/) on October 24, 2013 at the Techmart in Santa Clara, CA.

Freescale Semiconductor has been a leader and active participant in governance of standards development organizations such as Accellera and the IEEE Standards Association (IEEE-SA). Freescale was one of the organizations that identified interoperability issues within verification of complex system-on-chip (SoC) designs that were impacting their next generation of products. The company's leadership in consensus building and technical contributions was instrumental in the creation of the Universal Verification Methodology (UVM™) under the Accellera Systems Initiative. Leveraging these efforts, Freescale also deployed the new standards-based methodology and drove EDA tool adoption. Now, completing the full cycle of standardization, Freescale is sharing its experience for continued improvement of such solutions.

"The formation of a universal methodology for interoperable verification solutions has benefited companies across the industry, increasing productivity and reducing errors," said Dr. Magdy Abadir, director of Design Automation at Freescale Semiconductor. "On behalf of my colleagues at Freescale, we are honored to receive this award and to be recognized for helping to foster interoperability in the industry."

"Freescale Semiconductor has worked to promote collaborative efforts in solving complex design and verification challenges," said Rich Goldman, vice president of corporate marketing and strategic market development at Synopsys. "We applaud their leadership and technical contribution to the development of standards-based interoperability solutions for the semiconductor industry."

About the Tenzing Norgay Interoperability Achievement Award

The Tenzing Norgay Interoperability Achievement Award was established by Synopsys to recognize EDA providers and users who collaborate on interoperable design flows that benefit the community. The award is presented annually to companies, organizations, universities and individuals who have surpassed common levels of interoperability, have contributed to overall industry advancement and have helped provide a new view of the future for EDA interoperability. Named for the crucial role that Sherpa Tenzing Norgay played in the first successful attempt to reach the summit of Mount Everest in 1953, the Interoperability Achievement Award recognizes achievements that are critical to a designer's success.

About Synopsys

Synopsys, Inc. (Nasdaq:SNPS) accelerates innovation in the global electronics market. As a leader in electronic design automation (EDA) and semiconductor IP, Synopsys delivers software, IP and services to help engineers address their design, verification, system and manufacturing challenges. Since 1986, engineers around the world have been using Synopsys technology to design and create billions of chips and systems. Learn more at www.synopsys.com.

Synopsys is registered trademark of Synopsys, Inc.  Freescale is a trademark of Freescale Semiconductor, Inc. UVM is a trademark of Accellera Organization, Inc. Any other trademarks or registered trademarks mentioned in this release are the intellectual property of their respective owners.

Editorial Contacts:

Monica Marmie
Synopsys, Inc.
650-584-4547
monical@synopsys.com

Deanna Doyon
MCA, Inc.
650-968-8900 ext. 203
ddoyon@mcapr.com

SOURCE Synopsys, Inc.